Title :
A Transconductor and Tunable
High-Pass Filter Linearization Technique Using Feedforward
Ca
Author :
Duksoo Kim ; Byungjoon Kim ; Sangwook Nam
Author_Institution :
Appl. Electromagn. Lab., Seoul Nat. Univ., Seoul, South Korea
Abstract :
A linearization technique of a transconductor circuit is proposed in this brief. By adopting a two-path feedforward architecture, the Gm3 component of the transconductor vanishes and a highly linear V-to-I conversion is achieved. This technique consists of self-biased inverters only, and it can be applied to transconductors with differential inputs. It also has an advantage in process scaling and precise bias control is not necessary. A tunable Gm-C high-pass filter for the baseband of a frequency- modulated continuous-wave radar system is implemented using these linearized transconductors. The filter is synthesized with a high-order admittance method. The designed filter is fabricated in a 0.13-μm CMOS process. The filter cutoff frequency can be tuned from 0.15 to 0.75 MHz with a current consumption value of 11-36 mA. An in-band input-referred third-order intercept point of +19.4 dBm and a 1-dB compression point of +5.35 dBm are measured, demonstrating a highly linear filter operation.
Keywords :
CMOS integrated circuits; CW radar; FM radar; high-pass filters; invertors; linearisation techniques; CMOS process; Gm-C high-pass filter; V-to-I conversion; current 11 mA to 36 mA; feedforward Gm3 canceling; frequency 0.15 MHz to 0.75 MHz; frequency-modulated continuous-wave radar system; high-order admittance; in-band input-referred third-order intercept point; linearization technique; self-biased inverters; size 0.13 mum; transconductor circuit; transconductor high-pass filter; tunable high-pass filter; two-path feedforward architecture; Cutoff frequency; Information filters; Linearity; Linearization techniques; Maximum likelihood detection; Nonlinear filters; $G_{m}-C$ filter; linearization; transconductor; tunable high-pass filter;
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2015.2456611