Title :
Effect of Topological Bumpy Surface Underlayer on Compositionally Modulated Atomic Layer Stacking in High
hcp Co
80Pt
20 Film With (00.2) Crystallograph
Author :
Tham, Kim Kong ; Hinata, Shintaro ; Saito, Shin
Author_Institution :
Tanaka Kikinzoku Kogyo K. K., Tokyo, Japan
Abstract :
The effect of topological bumpy surface underlayer on compositionally modulated atomic layer stacking in high uniaxial magnetocrystalline anisotropy (Ku) hcp Co80Pt20 film with (00.2) crystallographic texture orientation was investigated. In this paper, the following has been discussed. Concerning preparation of underlayer with various morphologies, an annealing process prior to the deposition of Co80Pt20 film, and introduction of a metal-oxide buffer layer are effective to obtain underlayers with surface roughness ranging from ~0.4 to 2 nm and grain size ranging from ~6.7 to 12.5 nm. To realize a compositionally modulated atomic layer stacking structure, which is confirmed by the high angle annular dark field detector scanning transmission electron microscopy observation, an underlayer with surface roughness less than ~1 nm and/or grain size larger than ~8 nm is required. The compositional modulation shows the same normal direction as substrate normal and the c-axis direction of the hcp grain. To reach Ku of ~1.7 × 107 erg/cm3, surface roughness reduction to ~0.5 nm and grain size increase to ~12 nm are needed.
Keywords :
annealing; buffer layers; cobalt alloys; grain size; magnetic anisotropy; magnetic thin films; metallic thin films; platinum alloys; ruthenium; scanning-transmission electron microscopy; silicon compounds; sputter deposition; surface roughness; texture; Co80Pt20-Ru-SiO2; annealing; compositionally modulated atomic layer stacking structure; crystallographic texture orientation; grain size; high Ku hcp cobalt platinum film; high angle annular dark field detector scanning transmission electron microscopy; high uniaxial magnetocrystalline anisotropy; magnetron sputtering; metal-oxide buffer layer; morphology; surface roughness; topological bumpy surface underlayer effect; Films; Grain size; Rough surfaces; Surface morphology; Surface roughness; Surface topography; Surface treatment; CoPt film; Compositionally modulated atomic layer stacking; Perpendicular magnetic recording; compositionally modulated atomic layer stacking,; high $K_{u}$; high K u CoPt film; perpendicular magnetic recording;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2015.2458016