DocumentCode
3603836
Title
Effect of Topological Bumpy Surface Underlayer on Compositionally Modulated Atomic Layer Stacking in High
hcp Co80Pt20 Film With (00.2) Crystallograph
Author
Tham, Kim Kong ; Hinata, Shintaro ; Saito, Shin
Author_Institution
Tanaka Kikinzoku Kogyo K. K., Tokyo, Japan
Volume
51
Issue
11
fYear
2015
Firstpage
1
Lastpage
4
Abstract
The effect of topological bumpy surface underlayer on compositionally modulated atomic layer stacking in high uniaxial magnetocrystalline anisotropy (Ku) hcp Co80Pt20 film with (00.2) crystallographic texture orientation was investigated. In this paper, the following has been discussed. Concerning preparation of underlayer with various morphologies, an annealing process prior to the deposition of Co80Pt20 film, and introduction of a metal-oxide buffer layer are effective to obtain underlayers with surface roughness ranging from ~0.4 to 2 nm and grain size ranging from ~6.7 to 12.5 nm. To realize a compositionally modulated atomic layer stacking structure, which is confirmed by the high angle annular dark field detector scanning transmission electron microscopy observation, an underlayer with surface roughness less than ~1 nm and/or grain size larger than ~8 nm is required. The compositional modulation shows the same normal direction as substrate normal and the c-axis direction of the hcp grain. To reach Ku of ~1.7 × 107 erg/cm3, surface roughness reduction to ~0.5 nm and grain size increase to ~12 nm are needed.
Keywords
annealing; buffer layers; cobalt alloys; grain size; magnetic anisotropy; magnetic thin films; metallic thin films; platinum alloys; ruthenium; scanning-transmission electron microscopy; silicon compounds; sputter deposition; surface roughness; texture; Co80Pt20-Ru-SiO2; annealing; compositionally modulated atomic layer stacking structure; crystallographic texture orientation; grain size; high Ku hcp cobalt platinum film; high angle annular dark field detector scanning transmission electron microscopy; high uniaxial magnetocrystalline anisotropy; magnetron sputtering; metal-oxide buffer layer; morphology; surface roughness; topological bumpy surface underlayer effect; Films; Grain size; Rough surfaces; Surface morphology; Surface roughness; Surface topography; Surface treatment; CoPt film; Compositionally modulated atomic layer stacking; Perpendicular magnetic recording; compositionally modulated atomic layer stacking,; high $K_{u}$; high K u CoPt film; perpendicular magnetic recording;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.2015.2458016
Filename
7161365
Link To Document