DocumentCode
3604640
Title
Design and Simulation of Device-Level Vacuum-Packaged Microbolometer With Integrated Optical Filter
Author
Ahmed, Moinuddin ; Butler, Donald P.
Author_Institution
Microelectron. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
Volume
15
Issue
12
fYear
2015
Firstpage
6986
Lastpage
6994
Abstract
In this paper, we have reported the design and simulation of uncooled microbolometer infrared radiation detectors. We have demonstrated several improvements in design over the conventional microbolometers such a double-layer absorption structure instead of single-layer absorber; a nanomesh radiation absorber to improve thermal isolation of the thermometer structure; device-level vacuum packaging which serves to limit thermal convection away from the detector; the monolithic integration of an optical filter into the device-level vacuum package to reduce the absorption of visible radiation and thus reduce the photo-generation of carriers in the amorphous silicon thermometer.
Keywords
bolometers; integrated optics; microsensors; optical filters; packaging; thermometers; Si; amorphous silicon thermometer; carriers photo-generation; device-level vacuum-packaged microbolometer; double-layer absorption structure; integrated optical filter; monolithic integration; nanomesh radiation absorber; thermal convection; thermal isolation; uncooled microbolometer infrared radiation detectors; visible radiation absorption; Absorption; Detectors; Encapsulation; Substrates; Thermal conductivity; Infrared detector; device-level vacuum packaging; double layer absorber; infrared detector; nanomesh structure; optical filter;
fLanguage
English
Journal_Title
Sensors Journal, IEEE
Publisher
ieee
ISSN
1530-437X
Type
jour
DOI
10.1109/JSEN.2015.2469654
Filename
7208785
Link To Document