• DocumentCode
    3604640
  • Title

    Design and Simulation of Device-Level Vacuum-Packaged Microbolometer With Integrated Optical Filter

  • Author

    Ahmed, Moinuddin ; Butler, Donald P.

  • Author_Institution
    Microelectron. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
  • Volume
    15
  • Issue
    12
  • fYear
    2015
  • Firstpage
    6986
  • Lastpage
    6994
  • Abstract
    In this paper, we have reported the design and simulation of uncooled microbolometer infrared radiation detectors. We have demonstrated several improvements in design over the conventional microbolometers such a double-layer absorption structure instead of single-layer absorber; a nanomesh radiation absorber to improve thermal isolation of the thermometer structure; device-level vacuum packaging which serves to limit thermal convection away from the detector; the monolithic integration of an optical filter into the device-level vacuum package to reduce the absorption of visible radiation and thus reduce the photo-generation of carriers in the amorphous silicon thermometer.
  • Keywords
    bolometers; integrated optics; microsensors; optical filters; packaging; thermometers; Si; amorphous silicon thermometer; carriers photo-generation; device-level vacuum-packaged microbolometer; double-layer absorption structure; integrated optical filter; monolithic integration; nanomesh radiation absorber; thermal convection; thermal isolation; uncooled microbolometer infrared radiation detectors; visible radiation absorption; Absorption; Detectors; Encapsulation; Substrates; Thermal conductivity; Infrared detector; device-level vacuum packaging; double layer absorber; infrared detector; nanomesh structure; optical filter;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2015.2469654
  • Filename
    7208785