• DocumentCode
    3604850
  • Title

    Metamaterial-Based Terahertz Imaging

  • Author

    Carranza, Ivonne Escorcia ; Grant, James ; Gough, John ; Cumming, David R. S.

  • Author_Institution
    Microsyst. Technol. Group, Univ. of Glasgow, Glasgow, UK
  • Volume
    5
  • Issue
    6
  • fYear
    2015
  • Firstpage
    892
  • Lastpage
    901
  • Abstract
    This paper presents the design of an innovative, low-cost, uncooled, metamaterial-based terahertz (THz) focal plane array (FPA). A single pixel is composed of a resonant metamaterial absorber and micro-bolometer sensor integrated in a standard 180 nm CMOS process. The metamaterial is made directly in the metallic and insulating layers available in the six metal layer CMOS foundry process. THz absorption is determined by the geometry of the metamaterial absorber which can be customized for different frequencies. The initial prototype consists of a 5 ×5 pixel array with a pixel size of 30 μm ×30 μm and is readily scalable to more commercially viable array sizes. The FPA imaging capability is demonstrated in a transmission and reflection mode experiment by scanning a metallic object hidden in a manila envelope.
  • Keywords
    CMOS integrated circuits; focal planes; geometry; metamaterial antennas; terahertz wave imaging; CMOS process; FPA imaging capability; metal layer CMOS foundry process; metamaterial-based terahertz focal plane array; metamaterial-based terahertz imaging; micro-bolometer sensor; resonant metamaterial absorber; Absorption; Arrays; CMOS integrated circuits; Detectors; Imaging; Metals; Voltage measurement; Imaging; Terahertz; metamaterial;
  • fLanguage
    English
  • Journal_Title
    Terahertz Science and Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-342X
  • Type

    jour

  • DOI
    10.1109/TTHZ.2015.2463673
  • Filename
    7217855