Title :
Highly Sensitive Tactile Sensing Array Realized Using a Novel Fabrication Process With Membrane Filters
Author :
Cheng-Wen Ma ; Chia-Ming Chang ; Ting-Hao Lin ; Yang, Yao-Joe Joseph
Author_Institution :
Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
This paper presents a highly sensitive tactile sensing array. Sensing elements of the array comprise multiwall carbon nanotubes and polydimethylsiloxane polymer. A novel lithography process is proposed for fabricating an SU-8 mold for shaping the sensing cells in the array. In addition, a nylon membrane filter is proposed to serve as a mold for numerous microdome patterns, which were transferred onto a conductive polymer film. The proposed device features advantages, such as ultra-high sensitivity, flexibility, and a simple fabrication process. Tunneling piezoresistive effects of interlocked microdome structures fabricated using membrane filters with different pore sizes were observed. The measured maximum sensitivity and typical response time were approximately -7.73 kPa-1 and 4 ms, respectively. In addition, the measured results show that the patterned polymer composite arranged in a row-column array can effectively eliminate the crosstalk effect. Moreover, measurements for various tactile sensing applications were demonstrated.
Keywords :
lithography; multi-wall carbon nanotubes; piezoresistive devices; polymer films; tactile sensors; C; SU-8 mold; conductive polymer film; fabrication process; highly sensitive tactile sensing array; interlocked microdome structures; lithography process; membrane filters; microdome patterns; multiwall carbon nanotubes; nylon membrane filter; patterned polymer composite; polydimethylsiloxane polymer; row-column array; tunneling piezoresistive effects; Arrays; Fabrication; Force; Polymers; Robot sensing systems; Sensitivity; Carbon nanotubes; conductive polymer; membrane filter; polydimethylsiloxane (PDMS); tactile sensor; tactile sensor.;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2015.2469252