• DocumentCode
    3604907
  • Title

    A New Hybrid Micromachined Contactless Suspension With Linear and Angular Positioning and Adjustable Dynamics

  • Author

    Poletkin, Kirill ; Zhiqiu Lu ; Wallrabe, Ulrike ; Badilita, Vlad

  • Author_Institution
    Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg im Breisgau, Germany
  • Volume
    24
  • Issue
    5
  • fYear
    2015
  • Firstpage
    1248
  • Lastpage
    1250
  • Abstract
    In this letter, we present a new hybrid micromachined contactless suspension based on combining electromagnetic inductive and electrostatic actuation. In addition, the stiffness components are dynamically adjusted during the operation phase using a series of electrodes integrated in the contactless suspension structure. We experimentally demonstrate vertical linear positioning of a disk-shaped proof mass in a range from 30 to 200 μm, controlled tilting about two orthogonal axes in the horizontal plane ranges from ±1° to ±4°, as well as controlled oscillation about the vertical axis with an angular displacement of 37° at a frequency of 1.5 Hz. In order to demonstrate dynamical adjustment of the stiffness, we experimentally show that the angular component of stiffness is increased by a factor of two at a levitation height of 100 μm. Therefore, the suspension dynamics can be changed and adapted to particular applications or to variations in operational environments. Moreover, we demonstrate that this device can operate as a bistable micro-actuator.
  • Keywords
    microactuators; micromachining; suspensions (mechanical components); adjustable dynamics; angular displacement; angular positioning; bistable microactuator; contactless suspension structure; controlled oscillation; disk-shaped proof mass; electromagnetic inductive; electrostatic actuation; frequency 1.5 Hz; horizontal plane; hybrid micromachined contactless suspension; orthogonal axis; stiffness components; vertical axis; vertical linear positioning; Current measurement; Electrodes; Electrostatics; Levitation; Sensors; Silicon; Suspensions; 3D-micro-coils; 3D-micro-coils.; Levitation; bistable; contactless suspension; electrostatic suspension; frictionless micro-bearings; inductive suspension;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2015.2469211
  • Filename
    7222374