Title :
CMOS Power Amplifier on Top of Embedded Transformer for Compact Module
Author :
Byungjoon Park ; Jongjin Park ; Sangsu Jin ; Yunsung Cho ; Jooseung Kim ; Bumman Kim
Author_Institution :
Div. of IT Convergence Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
Abstract :
A small-sized high-performance complementary metal-oxide-semiconductor (CMOS) power amplifier (PA) module is presented. To reduce insertion loss of the output matching network (OMN), an off-chip transformer is designed on a FR-4 printed circuit board (PCB). To minimize the area of the OMN, the transformer is embedded underneath the PA chip. Coupling between the PA and the transformer is minimized so that the performance is not affected. For the 7.5 dB peak-to-average power ratio, 16-QAM long-term evolution signal, the proposed CMOS PA module achieves a power-added efficiency of 38.5% and an adjacent channel leakage ratio level under -31 dBc at an average output power of 27.5 dBm. The proposed technique can be used in any wireless Tx applications requiring small form-factor and high performance.
Keywords :
CMOS analogue integrated circuits; Long Term Evolution; printed circuit design; quadrature amplitude modulation; radio transmitters; radiofrequency power amplifiers; transformers; CMOS PA module; CMOS power amplifier; FR-4 printed circuit board; Long-Term Evolution signal; OMN; PA chip; PCB; QAM; adjacent channel leakage ratio level; complementary metal-oxide-semiconductor; embedded transformer; insertion loss; off-chip transformer; output matching network; peak-to-average power ratio; power-added efficiency; quadrature amplitude modulation; wireless Tx applications; CMOS integrated circuits; Couplings; Heterojunction bipolar transistors; Power amplifiers; Power generation; System-on-chip; Wireless communication; CMOS; power amplifier (PA); printed circuit board (PCB) transformer; small size;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2015.2463222