DocumentCode :
3605558
Title :
4-kV and 2.8- text{m}\\Omega -cm2 Vertical GaN p-n Diodes With Low Leakage Currents
Author :
Kizilyalli, I.C. ; Prunty, T. ; Aktas, O.
Author_Institution :
Avogy, Inc., San Jose, CA, USA
Volume :
36
Issue :
10
fYear :
2015
Firstpage :
1073
Lastpage :
1075
Abstract :
There is great interest in bulk GaN-based power electronics devices for applications requiring breakdown voltages greater than 3.3 kV. In this letter, the vertical GaN p-n diodes fabricated on improved bulk GaN substrates demonstrating low leakage currents (<;10 nA) and avalanche breakdown are discussed. The device layers are grown by metal-organic chemical vapor deposition on low defect density (104 cm-2) bulk GaN substrates with improved quality and specifications that are uniquely suitable for power electronic device applications. The measured devices show breakdown voltages larger than 4 kV with an area differential specific ON-resistance (Rsp) of less than 3 mΩ-cm2. Applications that would require such breakdown voltages, include ship propulsion, rail, wind, uninterruptable power supplies, and the power grid.
Keywords :
III-V semiconductors; MOCVD; avalanche breakdown; gallium compounds; leakage currents; power semiconductor diodes; semiconductor device breakdown; wide band gap semiconductors; GaN; avalanche breakdown; breakdown voltages; device layers; leakage currents; low defect density; metal-organic chemical vapor deposition; power electronics devices; power grid; ship propulsion; uninterruptable power supplies; vertical p-n diodes; voltage 4 kV; Gallium nitride; Junctions; Morphology; Semiconductor diodes; Silicon carbide; Substrates; Surface morphology; Gallium Nitride; Gallium nitride; avalanche breakdown; power diodes; power-semiconductor devices;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2015.2474817
Filename :
7247672
Link To Document :
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