DocumentCode
3605657
Title
Ideal RESURF Geometries
Author
Ferrara, Alessandro ; Boksteen, Boni K. ; Hueting, Raymond J. E. ; Heringa, Anco ; Schmitz, Jurriaan ; Steeneken, Peter G.
Author_Institution
MESA+ Inst. for Nanotechnol., Univ. of Twente, Enschede, Netherlands
Volume
62
Issue
10
fYear
2015
Firstpage
3341
Lastpage
3347
Abstract
In order to maximize the OFF-state breakdown voltage (BV) of semiconductor devices, the slope of the electric field in the drift extension along the current flow direction (Ex field) should be zero. This is achieved using the reduced surface field (RESURF) effect. This paper demonstrates a method to construct devices that obey Poisson´s equation and satisfy the ideal RESURF condition giving zero slope in Ex throughout the 2-D device region. The designs are obtained by shaping the device geometry and the boundaries and by applying the proper potentials at the boundaries. Using this method, ideal designs of the drift extension have been derived for devices based on graded doping, graded thickness, and graded field-plate potential. In addition, 2-D solutions have been derived for periodic superjunction device geometries. A solution for devices that combine several types of field shaping is demonstrated. Finally, the effect of nonideal geometries on the BV in more realistic geometries is discussed.
Keywords
Poisson equation; power MOSFET; semiconductor device breakdown; Poisson equation; breakdown voltage; current flow direction; drift extension; electric field; field shaping; graded doping; graded field-plate potential; graded thickness; ideal RESURF geometries; periodic superjunction device geometries; reduced surface field effect; semiconductor devices; Boundary conditions; Dielectrics; Doping; Electric potential; Geometry; Poisson equations; Shape; Charge balance; Silicon-on-insulator; electric field; field plate; high voltage; power MOSFET; reduced surface field (RESURF); superjunction; superjunction.;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2015.2460112
Filename
7258332
Link To Document