Title :
Piezoelectric sol-gel composite film fabrication by stencil printing
Author :
Kaneko, Tsukasa ; Iwata, Kazuki ; Kobayashi, Makiko
Author_Institution :
Grad. Sch. of Sci. & Technol., Kumamoto Univ., Kumamoto, Japan
Abstract :
Piezoelectric films using sol-gel composites could be useful as ultrasonic transducers in various industrial fields. For sol-gel composite film fabrication, the spray coating technique has been used often because of its adaptability for various substrates. However, the spray technique requires multiple spray coating processes and heating processes and this is an issue of concern, especially for on-site fabrication in controlled areas. Stencil printing has been developed to solve this issue because this method can be used to fabricate thick sol-gel composite films with one coating process. In this study, PbTiO3 (PT)/Pb(Zr,Ti)O3 (PZT) films, PZT/PZT films, and Bi4Ti3O12 (BiT)/PZT films were fabricated by stencil printing, and PT/ PZT films were also fabricated using the spray technique. After fabrication, a thermal cycle test was performed for the samples to compare their ultrasonic performance. The sensitivity and signal-to-noise-ratio (SNR) of the ultrasonic response of PT/PZT fabricated by stencil printing were equivalent to those of PT/PZT fabricated by the spray technique, and better than those of other samples between room temperature and 300°C. Therefore, PT/PZT films fabricated by stencil printing could be a good candidate for nondestructive testing (NDT) ultrasonic transducers from room temperature to 300°C.
Keywords :
bismuth compounds; composite materials; heat treatment; lead compounds; nondestructive testing; piezoelectric materials; piezoelectric thin films; sol-gel processing; spray coating techniques; ultrasonic transducers; Bi4Ti3O12-PZT; Bi4Ti3O12-PZT films; PZT-PZT; PZT-PZT films; PbTiO3-Pb(ZrTi)O3; PbTiO3-Pb(ZrTi)O3 films; heating processes; nondestructive testing; on-site fabrication; piezoelectric sol-gel composite film fabrication; signal-noise-ratio; spray coating technique; stencil printing; temperature 293 K to 300 degC; thermal cycle testing; ultrasonic performance; ultrasonic response; ultrasonic transducers; Acoustics; Dielectric constant; Fabrication; Powders; Printing; Substrates;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2014.006870