• DocumentCode
    3607240
  • Title

    Current Density and Quench Behavior of MgB 2/Ga Composite Wires

  • Author

    Ishmael, Sasha A. ; Rogers, Samuel ; Hunte, Frank ; Naderi, Golsa ; Roach, Christian ; Straka, Weston ; Schwartz, Justin

  • Author_Institution
    Dept. of Mater. Sci. & Eng., North Carolina State Univ., Raleigh, NC, USA
  • Volume
    25
  • Issue
    6
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Magnesium diboride (MgB 2) is a promising superconductor for many technical applications. Sufficient current densities at required magnetic fields, moderate operational temperature, low raw materials´ cost, and an economical manufacturing process have enabled commercial development of MgB 2 wires. Reacted MgB 2, however, is brittle, and applications involving coils and windings with small bend radii are therefore difficult to implement. Furthermore, improvements in the critical current density are needed to expand the range of potential applications. Here, we report on the electrical behavior of novel MgB 2/Ga composite wires produced such that the proximity effect enhances connectivity, allowing the high-temperature anneal typically required for in situ and ex situ MgB 2 wires to be eliminated. Elimination of the high-temperature anneal simplifies MgB 2 manufacturing and has the potential to create a wire that is more tolerant of bending. Here, we present critical current density and quench propagation results for MgB 2/Ga composite wires sheathed in Cu.
  • Keywords
    brittleness; current density; gallium; magnesium compounds; proximity effect (superconductivity); MgB2-Ga; brittleness; coils; composite wires; current density; magnesium diboride; proximity effect; quench behavior; superconductor; windings; Annealing; Current measurement; Gallium; Heating; Integrated circuits; Temperature measurement; Wires; Composite wires; magnesium diboride; proximity effect; quench;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2015.2483597
  • Filename
    7283573