Title :
Influence of Glass-Frit Material Distribution on the Performance of Precision Piezoresistive MEMS Pressure Sensors
Author :
Sandvand, Asmund ; Halvorsen, Einar ; Aasmundtveit, Knut E. ; Jakobsen, Henrik
Author_Institution :
Buskerud & Vestfold Univ. Coll., Borre, Norway
Abstract :
A microelectromechanical pressure sensor, including its vacuum reference cavity, has been modeled with focus on resulting stress from a glass-frit bonding process. Based on X-ray microtomography of bonded samples, a parametric model for the finite element analysis of variations in bonding material has been developed. The calculated influence on the sensor zero point and thermal coefficient of offset agrees well with measurements performed on various sensor variants. Signal changes during the first thermal cycles after glass-frit bonding were observed. We also observed the formation of microcracks in the excess glass-frit material during temperature cycling. The formation of these microcracks is shown to be a possible cause for the observed signal changes.
Keywords :
X-ray microscopy; bonding processes; computerised tomography; finite element analysis; glass; microcracks; microsensors; piezoresistive devices; pressure measurement; pressure sensors; temperature measurement; temperature sensors; X-ray microtomography; bonding material; finite element analysis; glass-frit bonding process; glass-frit material distribution; microcrack formation; microelectromechanical pressure sensor; parametric model; piezoresistive MEMS pressure sensor; temperature cycling; thermal coefficient; vacuum reference cavity; zero point coefficient; Bonding; Glass; Packaging; Silicon; Stress; Temperature measurement; Thermal stability; Finite-element analysis (FEA); glass-frit bonding; pressure sensor; pressure sensor.;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2015.2486018
