DocumentCode :
3609104
Title :
FinFET Evolution Toward Stacked-Nanowire FET for CMOS Technology Scaling
Author :
Peng Zheng ; Connelly, Daniel ; Fei Ding ; Tsu-Jae King Liu
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California at Berkeley, Berkeley, CA, USA
Volume :
62
Issue :
12
fYear :
2015
Firstpage :
3945
Lastpage :
3950
Abstract :
The performance of an evolutionary FinFET design (iFinFET) is benchmarked against that of the conventional bulk FinFET and stacked-nanowire gate-all-around (GAA) FET, through3-D device simulations, for both n-channel and p-channel transistors. The results show that the iFinFET provides for improved electrostatic integrity relative to the FinFET, but with substantially less gate capacitance penalty relative to the GAA FET. Thus, iFinFET technology offers a technological pathway for continued transistor scaling with performance improvement, for future low-power system-on-chip applications.
Keywords :
CMOS integrated circuits; MOSFET; nanowires; CMOS technology scaling; FinFET evolution; electrostatic integrity; gate-all-around FET; n-channel transistors; p-channel transistors; stacked-nanowire FET; transistor scaling; CMOS technology; FinFETs; Nanowires; System-on-chip; CMOS technology; FinFET; gate-all-around (GAA) FET; inserted-oxide FinFET (iFinFET); system-on-chip (SoC); system-on-chip (SoC).;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2015.2487367
Filename :
7308053
Link To Document :
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