Title :
Characteristics of electrohydrodynamic pump of the dissociation type: low and high voltage ranges
Author :
Chirkov, V.A. ; Stishkov, Yu.K. ; Vasilkov, S.A.
Author_Institution :
Phys. Dept., St. Petersburg State Univ., St. Petersburg, Russia
fDate :
10/1/2015 12:00:00 AM
Abstract :
The paper presents the computer simulation results for a single section of electrohydrodynamic (EHD) conduction pump with and without taking into account the enhancement of the dissociation rate under the action of the strong electric field (the Wien effect). The computations were carried out on the basis of the complete set of EHD equations using commercial software package COMSOL Multiphysics. The behavior of EHD flow inside the pump was investigated for different ratios between positive and negative ion mobilities and the effect of the latter on the pumping efficiency was estimated. The features of the pump operation in the case of the Wien effect presence were investigated. It was shown that the enhancement of the dissociation rate can lead to the reversion of EHD flow direction with increasing voltage. Besides, the results for the present computer model were compared to those for the simplified one (based on the hydrostatic approach), and considerable discrepancy between the calculated pressure drops was revealed.
Keywords :
Wien effect; computational fluid dynamics; dissociation; electrohydrodynamics; flow simulation; pumps; COMSOL Multiphysics; EHD equations; EHD flow; EHD flow direction; Wien effect; commercial software package; computer model; computer simulation; dissociation rate enhancement; dissociation type; electric field; electrohydrodynamic conduction pump section; electrohydrodynamic pump characteristics; negative ion mobilities; positive ion mobilities; pumping efficiency; Computational modeling; Conductivity; Electrodes; Force; Liquids; Mathematical model; Space charge; EHD conduction pumping; computer simulation; field-enhanceddissociation; ion mobility; low-conducting liquids;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2015.005044