DocumentCode
3609619
Title
Highly Efficient and Multipaction-Free P-Band GaN High-Power Amplifiers for Space Applications
Author
Ayllon, Natanael ; Arpesi, Pier Giorgio
Author_Institution
ESA-ESTEC, Eur. Space Agency, Noordwijk, Netherlands
Volume
63
Issue
12
fYear
2015
Firstpage
4429
Lastpage
4436
Abstract
In this paper, the authors report upon the development of multipaction-free P-band (UHF) GaN high-power amplifiers (HPAs) with target RF output power values of 140 W and power-added efficiency beyond 70%. Initially, two different 80-W class single-ended power modules were designed, manufactured, and tested using GaN devices from two different manufacturers. Load-pull techniques were used in both designs to achieve the best tradeoff in terms of RF output power, efficiency, and stability. Secondly, two identical power modules have been combined in a balanced architecture in order to obtain the required level of RF output power. Multipaction analyses and tests have been carried out to guarantee reliable operation in space. The HPAs have been characterized over temperature from -15 °C to +55 °C in pulsed and constant-wave conditions, showing negligible drifts over temperature and multipaction-free operation. RF output power in excess of 180 W at 70% drain efficiency is also demonstrated.
Keywords
III-V semiconductors; UHF power amplifiers; gallium compounds; modules; wide band gap semiconductors; GaN; UHF HPA; constant-wave condition; drain efficiency; efficiency 70 percent; load-pull technique; multipaction-free P-band high-power amplifier; power 140 W; power 80 W; power-added efficiency; pulsed-wave condition; single-ended power module; space application; temperature -15 C to 55 C; Couplers; Electric breakdown; Gallium nitride; HEMTs; Microstrip; Multichip modules; Radio frequency; Balanced amplifier; GaN; high efficiency; high-power amplifier (HPA); multipaction; satellite; stability;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2015.2493550
Filename
7313046
Link To Document