DocumentCode :
3609757
Title :
A Reactively Matched 1.0–11.5 GHz Hybrid Packaged GaN High Power Amplifier
Author :
Barisich, G. Christopher ; Ulusoy, A. Cagri ; Gebara, Edward ; Papapolymerou, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
25
Issue :
12
fYear :
2015
Firstpage :
811
Lastpage :
813
Abstract :
An ultra-wideband PA using a single GaN die with resistive and reactive matching is fabricated and measured. The design includes series and shunt elements at the gate for stability and gain compensation, and uses two different substrates to obtain optimum Z 0 ranges for the matching networks. CW measurements at 31 dBm source power show 27-48% PAE and 35.1-37.4 dBm output power from 1.0 to 11.5 GHz (168% relative bandwidth). These results demonstrate multi-watt output power and high PAE over a decade bandwidth, achieving the best results in this frequency range for a hybrid implementation.
Keywords :
HEMT integrated circuits; III-V semiconductors; field effect MMIC; gallium compounds; integrated circuit packaging; microwave power amplifiers; wide band gap semiconductors; GaN; frequency 1 GHz to 11.5 GHz; hybrid packaged high power amplifier; reactive matching; reactively matched high power amplifier; resistive matching; series element; shunt element; ultrawideband power amplifer; Bandwidth; Gallium nitride; Power amplifiers; Ultra wideband technology; Gallium nitride (GaN); X-band; hybrid-package; power amplifier; reactive matching; ultra-wideband PA;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2015.2495195
Filename :
7317818
Link To Document :
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