DocumentCode
3609757
Title
A Reactively Matched 1.0–11.5 GHz Hybrid Packaged GaN High Power Amplifier
Author
Barisich, G. Christopher ; Ulusoy, A. Cagri ; Gebara, Edward ; Papapolymerou, John
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
25
Issue
12
fYear
2015
Firstpage
811
Lastpage
813
Abstract
An ultra-wideband PA using a single GaN die with resistive and reactive matching is fabricated and measured. The design includes series and shunt elements at the gate for stability and gain compensation, and uses two different substrates to obtain optimum Z 0 ranges for the matching networks. CW measurements at 31 dBm source power show 27-48% PAE and 35.1-37.4 dBm output power from 1.0 to 11.5 GHz (168% relative bandwidth). These results demonstrate multi-watt output power and high PAE over a decade bandwidth, achieving the best results in this frequency range for a hybrid implementation.
Keywords
HEMT integrated circuits; III-V semiconductors; field effect MMIC; gallium compounds; integrated circuit packaging; microwave power amplifiers; wide band gap semiconductors; GaN; frequency 1 GHz to 11.5 GHz; hybrid packaged high power amplifier; reactive matching; reactively matched high power amplifier; resistive matching; series element; shunt element; ultrawideband power amplifer; Bandwidth; Gallium nitride; Power amplifiers; Ultra wideband technology; Gallium nitride (GaN); X-band; hybrid-package; power amplifier; reactive matching; ultra-wideband PA;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2015.2495195
Filename
7317818
Link To Document