• DocumentCode
    3609757
  • Title

    A Reactively Matched 1.0–11.5 GHz Hybrid Packaged GaN High Power Amplifier

  • Author

    Barisich, G. Christopher ; Ulusoy, A. Cagri ; Gebara, Edward ; Papapolymerou, John

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    25
  • Issue
    12
  • fYear
    2015
  • Firstpage
    811
  • Lastpage
    813
  • Abstract
    An ultra-wideband PA using a single GaN die with resistive and reactive matching is fabricated and measured. The design includes series and shunt elements at the gate for stability and gain compensation, and uses two different substrates to obtain optimum Z 0 ranges for the matching networks. CW measurements at 31 dBm source power show 27-48% PAE and 35.1-37.4 dBm output power from 1.0 to 11.5 GHz (168% relative bandwidth). These results demonstrate multi-watt output power and high PAE over a decade bandwidth, achieving the best results in this frequency range for a hybrid implementation.
  • Keywords
    HEMT integrated circuits; III-V semiconductors; field effect MMIC; gallium compounds; integrated circuit packaging; microwave power amplifiers; wide band gap semiconductors; GaN; frequency 1 GHz to 11.5 GHz; hybrid packaged high power amplifier; reactive matching; reactively matched high power amplifier; resistive matching; series element; shunt element; ultrawideband power amplifer; Bandwidth; Gallium nitride; Power amplifiers; Ultra wideband technology; Gallium nitride (GaN); X-band; hybrid-package; power amplifier; reactive matching; ultra-wideband PA;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2015.2495195
  • Filename
    7317818