DocumentCode :
3611423
Title :
Linking circuit simulation with full-wave solver for board-level EMC design
Author :
Barchanski, Andreas
Volume :
4
Issue :
3
fYear :
2015
Firstpage :
52
Lastpage :
58
Abstract :
In the fast paced electronics world, simulation has become an indispensable tool for every designer in recent years. In this paper, we present a guide to setting up a coupled simulation method from a SPICE-like circuit simulation and a full wave 3D simulation. This coupling offers the possibility to calculate the field distribution in a structure considering the effects of an attached circuit by applying the superposition theorem. As long as only elements on the circuit are modified, it allows fields to be calculated at the speed of a circuit simulation. The paper contains an introduction to the properties of time and frequency domain 3D solvers, discussing their effectiveness for different applications. In the main part of the paper we deal with the definition of ports in the 3D and circuit as the set-up of a coupled model needs special attention to the ground concept. Finally, the method is applied to the simulation of radiated and conducted emission on a realistic PCB.
Keywords :
SPICE; circuit simulation; electromagnetic compatibility; frequency-domain analysis; network synthesis; printed circuit design; time-domain analysis; PCB; SPICE-like circuit simulation; board-level EMC design; coupled simulation method; electromagnetic compatibility; field distribution; frequency domain 3D solver; full wave 3D simulation; full-wave solver; linking circuit simulation; printed circuit board; superposition theorem; time domain 3D solver; Electromagnetics; Frequency-domain analysis; Integrated circuit modeling; Ports (Computers); Solid modeling; Three-dimensional displays; Time-domain analysis;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility Magazine, IEEE
Publisher :
ieee
ISSN :
2162-2264
Type :
jour
DOI :
10.1109/MEMC.2015.7336756
Filename :
7336756
Link To Document :
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