3-D Embedded Packaging Technology: Analyzing its needs and challenges

For decades, the ever-increasing system equipment power density has continually challenged power electronic converter designers to provide more converted power in a smaller space. Each converter generation has met this challenge with incremental improvements. However, every so often, the challenge becomes so great that it requires a quantum leap with the assistance of advanced technology. Currently, we are at such an inflection point. The solution is three-dimensional (3-D) embedded packaging technology. While it has been implemented since early 2000 in small-signal assemblies, designers have just begun applying this technology to power electronics to meet the next-generation power density requirements.