Title :
Turn-to-turn insulation failure diagnosis of stator winding of low voltage induction motor with the aid of support vector machine
Author :
Yagami, Yusuke ; Araki, Chika ; Mizuno, Yukio ; Nakamura, Hisahide
Author_Institution :
Nagoya Inst. of Technol., Nagoya, Japan
fDate :
12/1/2015 12:00:00 AM
Abstract :
Turn-to-turn short-circuit of stator winding due to deterioration of electrical insulation is one of the most probable faults in motor drive systems. This paper proposes two diagnostic methods to detect the fault based on Support Vector Machine. In the first method, magnitude and phase of load currents at fixed rotating speeds are considered as features reflecting winding condition. It is found that the method is effective particularly in slight insulation failure like one turn-to-turn short-circuit. Classification of winding condition, i.e. specification of number of short-circuit turns, is also achieved by this method. In the second method, only magnitude of load currents is treated as feature aiming at diagnosis available when load current varies. The method also has the advantage of low cost and short data processing time. It is found that two turn-to-turn short-circuit can be diagnosed with practically acceptable accuracy. An appropriate choice of the two methods should be recommended depending on the goal as well as circumstance of diagnosis.
Keywords :
failure analysis; fault diagnosis; induction motor drives; machine insulation; power engineering computing; short-circuit currents; stators; support vector machines; electrical insulation deterioration; load current; low voltage induction motor stator winding; motor drive system fault; support vector machine aid; turn-to-turn insulation failure diagnosis; turn-to-turn short-circuit; Induction motors; Insulation; Low voltage; Stator windings; Support vector machines; Training data; Windings; Diagnosis; feature; induction motor; stator winding; support vector machine; turn-to-turn insulation failure;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2015.005198