• DocumentCode
    3612708
  • Title

    Absorption and permeation of water and aqueous solutions of high-temperature vulcanized silicone rubber

  • Author

    Wang, Z. ; Jia, Z.D. ; Fang, M.H. ; Guan, Z.C.

  • Author_Institution
    Grad. Sch. at Shenzhen, Tsinghua Univ., Shenzhen, China
  • Volume
    22
  • Issue
    6
  • fYear
    2015
  • fDate
    12/1/2015 12:00:00 AM
  • Firstpage
    3357
  • Lastpage
    3365
  • Abstract
    This study focuses on absorption and permeation of deionized water and typical aqueous solutions of high-temperature vulcanized (HTV) silicone rubber (SR). The influences of some parameters, such as, filler (fumed silica and aluminum hydroxide) characteristics, solution concentration, temperature, and tensile stress on absorption of water/solution were investigated. Results indicate that tensile stress accelerates water and solution uptake of HTV SR. The dependence of water and solution permeation coefficients of HTV SR on two important parameters, i.e., filler characteristics and the HTV SR sample thickness, were investigated. Permeation coefficient was found to be inversely proportional to SR thickness. The possible influencing mechanism of tensile stress on water and solution absorption and that of filler characteristics on water absorption and permeation were discussed. Moreover, the free volume, which is filled by the absorbed water, plays an important role in water absorption and permeation.
  • Keywords
    absorption; composite insulating materials; filled polymers; permeability; silicone rubber insulators; aluminum hydroxide filler; aqueous solutions; deionized water; fumed silica filler; high-temperature vulcanized silicone rubber; water absorption; water permeation; Absorption; Electron tubes; Liquids; Ocean temperature; Rubber; Tensile stress; Water and solution absorption; free volume; silicone rubber thickness; tensile stress; water and solution permeation;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2015.005192
  • Filename
    7367532