DocumentCode
3612723
Title
Field emission from graphene produced with use of chemical vapor deposition method
Author
Mazurek, Boles?…â€?aw ; Mielcarek, Witold ; Warycha, Joanna ; Prociow, Krystyna ; Chmielowiec, Jacek ; Znamierowski, Zbigniew ; Popko, Ewa
Author_Institution
Electrotech. Inst., Wroclaw, Poland
Volume
22
Issue
6
fYear
2015
fDate
12/1/2015 12:00:00 AM
Firstpage
3498
Lastpage
3504
Abstract
The influence of graphene deposition on emission spectrum of Cu electrodes was investigated. In this order the two types of samples were prepared: one from a pure copper plate, and one from a copper plate covered with graphene. The graphene has been obtained using Chemical Vapor Deposition (CVD) method. The analysis of I=f(E) and Fowler-Nordheim (F-N) characteristics showed that a graphene layer uniformly deposited on a cathode, parallel to its surface creates a shielding for microprotrusions which causes a decrease of electric field and, consequently, the β coefficient. This occurs regardless whether the sample surface had been etched before graphene deposition or not. The F-N characteristics showed that the cathode emission mechanism is changing with the increase of field intensity. Initially, the emission current is blocked by a surface adsorption layer. With further increase of the field intensity, up the Eth value, a typical F- N mechanism occurs until microdischarges appear. As a result of microdischarges, under the influence of cathode potential, electrons are emitted, which bombard the anode. This current has a form of pulses repeated approximately every 4.5 ns until plasma is created on anode, what is in fact equivalent to a breakdown.
Keywords
adsorption; chemical vapour deposition; copper; field emission; graphene; β coefficient; C; CVD; Cu; Cu electrodes; F-N characteristics; Fowler-Nordheim characteristics; cathode emission mechanism; chemical vapor deposition; electric field; emission current; emission spectrum; field emission; field intensity; graphene deposition; graphene layer; microdischarges; microprotrusions; pure copper plate; surface adsorption layer; Anodes; Cathodes; Chemical vapor deposition; Copper; Graphene; Surface discharges; Surface treatment; CVD method; Graphene; electric breakdown; electrodes; electron emission; vacuum insulation;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2015.005168
Filename
7367547
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