Title :
Training program in electronic passive components education
Author :
P. Svasta;V. Golumbeanu;C. Ionescu;N.D. Codreanu;D. Leonescu;M. Vladescu;D.T. Vuza
Author_Institution :
Dept. of Electron. Technol. & Reliability, Bucharest Univ., Romania
fDate :
6/24/1905 12:00:00 AM
Abstract :
One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspective that includes electrical, mechanical, thermal, technological and other points of view. This huge amount of knowledge must be appropriate for the packaging engineers. In the near future the demand for such specialists will dramatically increase and that is why the university must be able to support their education in undergraduate programs and curricula.
Keywords :
"Educational programs","Impedance","Resistors","Capacitors","Electronic components","Electronic equipment","Electronics packaging","Electronic packaging thermal management","Ceramics","Packaging machines"
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008188