DocumentCode :
3613495
Title :
Modeling thermal contact resistance between elastic hemisphere and elastic layer bonded to elastic substrate
Author :
M. Stevanovic
Author_Institution :
C-MAC Eng. Inc., Kanata, Ont., Canada
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
193
Lastpage :
200
Abstract :
An approximate thermo-mechanical model is developed to predict thermal contact resistance of a hemisphere in elastic contact with a layered substrate. Numerical data are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. The complex solution is reduced to a simple closed form solution for the unknown contact radius. The proposed thermo-mechanical model is applicable for any layer-substrate material combination over the full range of the layer thicknesses. The agreement between the theoretical predictions and experimental data is good at the light loads. A method for correcting the contact radius for elastic-plastic behavior at higher loads is presented.
Keywords :
"Thermal resistance","Contact resistance","Bonding","Thermal conductivity","Heat transfer","Resistance heating","Thermal loading","Thermal stresses","Electronic packaging thermal management","Surface resistance"
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012457
Filename :
1012457
Link To Document :
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