Title :
Modeling thermal contact resistance between elastic hemisphere and elastic layer bonded to elastic substrate
Author_Institution :
C-MAC Eng. Inc., Kanata, Ont., Canada
fDate :
6/24/1905 12:00:00 AM
Abstract :
An approximate thermo-mechanical model is developed to predict thermal contact resistance of a hemisphere in elastic contact with a layered substrate. Numerical data are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. The complex solution is reduced to a simple closed form solution for the unknown contact radius. The proposed thermo-mechanical model is applicable for any layer-substrate material combination over the full range of the layer thicknesses. The agreement between the theoretical predictions and experimental data is good at the light loads. A method for correcting the contact radius for elastic-plastic behavior at higher loads is presented.
Keywords :
"Thermal resistance","Contact resistance","Bonding","Thermal conductivity","Heat transfer","Resistance heating","Thermal loading","Thermal stresses","Electronic packaging thermal management","Surface resistance"
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012457