• DocumentCode
    3614318
  • Title

    Low temperature flip-chip process using ICA and NCA (isotropically and non-conductive adhesive) for flexible displays application

  • Author

    J. Vanfleteren;B. Vandecasteele;T. Podprocky

  • Author_Institution
    Imec/Intec/TFCG, Gent, Belgium
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    139
  • Lastpage
    143
  • Abstract
    The paper investigates the possibilities to flip-chip assemble Si driver chips onto a flexible display, which is to be integrated in a smart card. The chips are Ni/Au bumped, the substrate material consists of PES (polyether sulphone) with conductive ITO pads. An original technology, using ICA and NCA was proven to be applicable in a quite straightforward way with measured contact resistances below 5/spl Omega/.
  • Keywords
    "Temperature","Independent component analysis","Nonconductive adhesives","Displays","Assembly","Smart cards","Gold","Conducting materials","Indium tin oxide","Electrical resistance measurement"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2002. 4th
  • Print_ISBN
    0-7803-7435-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2002.1185656
  • Filename
    1185656
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3614318