• DocumentCode
    3614982
  • Title

    Some aspects of lead free soldering

  • Author

    J. Stary;I. Szendiuch

  • Author_Institution
    Fac. of Electr. Eng. & Commun. Technol., Brno Univ. of Technol., Czech Republic
  • fYear
    2003
  • fDate
    6/25/1905 12:00:00 AM
  • Firstpage
    175
  • Lastpage
    178
  • Abstract
    Lead free soldering implementation process needs some knowledge´s about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and optimized soldering process settings.
  • Keywords
    "Environmentally friendly manufacturing techniques","Lead","Soldering","Surface morphology","Copper alloys","Temperature distribution","Inorganic materials","Tin alloys","Computational Intelligence Society","Atmosphere"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
  • Print_ISBN
    0-7803-8002-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2003.1260510
  • Filename
    1260510
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3614982