DocumentCode
3614992
Title
Thermal shock reliability tests of multilayer LTCC modules with thick film conductors
Author
A. Pietrikova;J. Bansky;M. Bujalobokova;J. Urbancik
Author_Institution
Dept. of Technol. in Electron., Kosice Tech. Univ., Slovakia
fYear
2003
fDate
6/25/1905 12:00:00 AM
Firstpage
485
Lastpage
488
Abstract
This paper deals with bent modules based on LTCC (low temperature cofired ceramic) for electronics related to reliability and of thermal cyclic stress stability in the temperature range from -40/spl deg/C to +125/spl deg/C. The interpretation of the thermal shock influence on electrical parameters of built-in conductive paths at bent multilayer LTCC modules refers to the fatigue of thick film conductors and ceramic materials as well as on failure and broken down initiator.
Keywords
"Thermal conductivity","Electric shock","Testing","Nonhomogeneous media","Thick films","Conductive films","Temperature distribution","Ceramics","Thermal stresses","Conducting materials"
Publisher
ieee
Conference_Titel
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN
0-7803-8002-9
Type
conf
DOI
10.1109/ISSE.2003.1260578
Filename
1260578
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