مرکز منطقه ای اطلاع رساني علوم و فناوري - Electromigrationreliability of Cu interconnects and impact of low K dielectrics

DocumentCode :

3618395

Title :

Electromigrationreliability of Cu interconnects and impact of low K dielectrics

Author :

P.S. Ho;M. Gall

fYear :

2004

fDate :

6/26/1905 12:00:00 AM

Firstpage :

197

Lastpage :

197

Keywords :

"Dielectrics","Microelectronics","Artificial intelligence","Statistics","Threshold current","Thermomechanical processes"

Publisher :

ieee

Conference_Titel :

Integrated Reliability Workshop Final Report, 2004 IEEE International

Print_ISBN :

0-7803-8517-9

Type :

conf

DOI :

10.1109/IRWS.2004.1422781

Filename :

1422781

Link To Document :