• DocumentCode
    3619272
  • Title

    Temperature field simulation of thick-film microcircuits using finite element method

  • Author

    G. Bad;W. Kalita;D. Klepacki;F. Rozak;M. Weglarski

  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    140
  • Lastpage
    143
  • Keywords
    "Finite element methods","Heat transfer","Differential equations","Boundary conditions","Nonlinear equations","Mathematical analysis","Temperature distribution","Circuit simulation","Finite difference methods","Boundary element methods"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
  • Print_ISBN
    0-7803-9325-2
  • Type

    conf

  • DOI
    10.1109/ISSE.2005.1491015
  • Filename
    1491015
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3619272