• DocumentCode
    3619485
  • Title

    Thermal Issues in LDMOSFET Packages

  • Author

    P. Khandelwal;M. Trivedi;K. Shenai

  • Author_Institution
    University of Illinois at Chicago, Chicago, IL, United States
  • fYear
    1998
  • fDate
    6/20/1905 12:00:00 AM
  • Firstpage
    556
  • Lastpage
    559
  • Keywords
    "Packaging","Radio frequency","Power dissipation","Power generation","Isothermal processes","Degradation","MOSFETs","Temperature dependence","Performance analysis","Heating"
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 1998. Proceeding of the 28th European
  • Print_ISBN
    2-86332-234-6
  • Type

    conf

  • Filename
    1503612
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3619485