• DocumentCode
    3619912
  • Title

    Die-on-wafer and wafer-level 3D integration for millimeter-wave smart antenna tranceivers

  • Author

    M.M. Hella;S. Devarajan;J.-Q. Lu;K. Rose;R.J. Gutmann

  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    21
  • Lastpage
    21
  • Keywords
    "Transceivers","Inductors","Silicon germanium","Germanium silicon alloys","BiCMOS integrated circuits","High power amplifiers","Radiofrequency amplifiers","Noise figure","Power amplifiers"
  • Publisher
    ieee
  • Conference_Titel
    Wireless and Microwave Technology, 2005. WAMICON 2005. The 2005 IEEE Annual Conference
  • Print_ISBN
    0-7803-8861-5
  • Type

    conf

  • DOI
    10.1109/WAMIC.2005.1528358
  • Filename
    1528358
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3619912