DocumentCode :
3621150
Title :
Characterization of bonded wafer for RF filters with reduced TCF
Author :
B.P. Abbott;J. Chocola;K. Lin;N. Naumenko;J. Caron
Volume :
2
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
926
Lastpage :
929
Keywords :
"Wafer bonding","Radio frequency","Filters","Surface acoustic waves","Silicon","Temperature","Lithium compounds","Glass","Capacitance","Resonant frequency"
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2005 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-9382-1
Type :
conf
DOI :
10.1109/ULTSYM.2005.1603002
Filename :
1603002
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3621150
