DocumentCode :
3621241
Title :
Low temperature bonding of interface acoustic waves resonators on silicon wafers
Author :
H. Majjad;V. Laude;S. Ballandras
Volume :
2
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
1307
Lastpage :
1310
Keywords :
"Temperature","Wafer bonding","Acoustic waves","Silicon","Frequency","Surface acoustic wave devices","Lithium niobate","Surface acoustic waves","Surface contamination","Finite element methods"
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2005 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-9382-1
Type :
conf
DOI :
10.1109/ULTSYM.2005.1603093
Filename :
1603093
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3621241
