DocumentCode :
3621531
Title :
Process technology advanced interconnect technology
Author :
V. Wang;G. Beyer
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
76
Lastpage :
76
Keywords :
"Paper technology","Copper","National electric code","Reliability engineering","Microelectronics","Metallization","Dielectric materials","Inorganic materials"
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Print_ISBN :
0-7803-9268-X
Type :
conf
DOI :
10.1109/IEDM.2005.1609270
Filename :
1609270
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3621531
