DocumentCode
3622191
Title
Analysis of Multilayer Boxed Printed Circuits
Author
P. Crespo-Valero;M. Mattes;I. Stevanovic;J.R. Mosig
Author_Institution
Laboratory of Electromagnetics and Acoustics (LEMA), É
fYear
2006
fDate
6/28/1905 12:00:00 AM
Firstpage
206
Lastpage
209
Abstract
This paper presents an efficient integral equation (IE) formulation based on the method of moments (MoM) for analysis of packaged printed circuits embedded within a multilayered medium. The approach uses a robust algorithm for computing the parameters of equivalent transmission lines, the analytic integration of MoM reaction terms, and the acceleration technique based on the extraction of quasi-static part. The algorithms are implemented in the simulation tool MAMBO (simulation of arbitrary multilayer boxed printed circuits). The simulation results of several packaged multilayered circuits show good agreement with the results obtained using commercial simulation tools, outperforming them in terms of computational time
Keywords
"Nonhomogeneous media","Printed circuits","Computational modeling","Circuit simulation","Packaging","Integral equations","Moment methods","Robustness","Distributed parameter circuits","Algorithm design and analysis"
Publisher
ieee
Conference_Titel
Electrotechnical Conference, 2006. MELECON 2006. IEEE Mediterranean
ISSN
2158-8473
Print_ISBN
1-4244-0087-2
Electronic_ISBN
2158-8481
Type
conf
DOI
10.1109/MELCON.2006.1653073
Filename
1653073
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