• DocumentCode
    3623347
  • Title

    Overview of IBM glass ceramic packaging technology

  • Author

    R. Tummala;B.T. Clark;H. Bhatia;S. Kadakia

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1993
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    A major technological break-through was achieved with the design and development of the ES9000 glass-ceramic/copper substrate. Since then many innovations have been made to enhance the packaging technology to meet the demand of high end machines including supercomputer applications. Two technology alternatives are discussed in this paper. Both are aimed at achieving high density, yet they differ quite a bit in their applications. Various aspects of the packaging technology are described here.
  • Keywords
    "Glass","Ceramics","Dielectric thin films","Impedance","Wiring","Pins","Packaging machines","Application software","Cooling","Technological innovation"
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346860
  • Filename
    346860
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3623347