Title :
Overview of IBM glass ceramic packaging technology
Author :
R. Tummala;B.T. Clark;H. Bhatia;S. Kadakia
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
A major technological break-through was achieved with the design and development of the ES9000 glass-ceramic/copper substrate. Since then many innovations have been made to enhance the packaging technology to meet the demand of high end machines including supercomputer applications. Two technology alternatives are discussed in this paper. Both are aimed at achieving high density, yet they differ quite a bit in their applications. Various aspects of the packaging technology are described here.
Keywords :
"Glass","Ceramics","Dielectric thin films","Impedance","Wiring","Pins","Packaging machines","Application software","Cooling","Technological innovation"
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346860
