Electrical characterization of interconnects in polyimide-copper thin film multilayer on ceramic substrate

A full electrical characterization of a polyimide-copper thin film multilayer on a ceramic substrate is presented. It contains test structures with three different types of ground, i.e., continuous solid ground, meshed ground with octagonal holes, and meshed ground with rectangular holes. The electrical performance in terms of impedance, effective permittivity constant, crosstalk noise and losses is discussed. The results show clearly the effects of ground openings on signal transmission.