DocumentCode
3623750
Title
Third Generation Signal Integrity Tools and Issues
Author
George A. Katopis
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
3
Lastpage
4
Keywords
"Signal generators","Packaging","Integrated circuit interconnections","CMOS technology","Wiring","Ceramics","Manufacturing","Topology","Availability","Signal design"
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN
0-7803-9821-1
Type
conf
DOI
10.1109/SPI.2002.258264
Filename
4027639
Link To Document