DocumentCode :
3623750
Title :
Third Generation Signal Integrity Tools and Issues
Author :
George A. Katopis
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
3
Lastpage :
4
Keywords :
"Signal generators","Packaging","Integrated circuit interconnections","CMOS technology","Wiring","Ceramics","Manufacturing","Topology","Availability","Signal design"
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN :
0-7803-9821-1
Type :
conf
DOI :
10.1109/SPI.2002.258264
Filename :
4027639
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3623750