DocumentCode :
3623760
Title :
Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method
Author :
Heeseok Lee;Charlie Park;Derek Kam;Joungho Kim
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
41
Lastpage :
43
Keywords :
"Finite difference methods","Time domain analysis","Periodic structures","Integrated circuit interconnections","Packaging","Crosstalk","Transmission lines","Stripline","Boundary conditions","Wave functions"
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN :
0-7803-9821-1
Type :
conf
DOI :
10.1109/SPI.2002.258271
Filename :
4027650
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3623760
