DocumentCode :
3623763
Title :
Signal Integrity Design for High-Performance, Low-Cost Interconnects and Optoelectronics
Author :
Josh G. Nickel;Stanford W. Crane;Myoung-soo Jeon;Ton Wang;Zsolt Horvath;Sangwook Lee;Andreas C. Cangellaris Cangellari
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
55
Lastpage :
58
Keywords :
"Signal design","Connectors","Integrated circuit interconnections","Pins","Crosstalk","Electronic packaging thermal management","Manufacturing","Printed circuits","Transmission line matrix methods","Optical design"
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN :
0-7803-9821-1
Type :
conf
DOI :
10.1109/SPI.2002.258275
Filename :
4027654
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3623763
