DocumentCode
3623763
Title
Signal Integrity Design for High-Performance, Low-Cost Interconnects and Optoelectronics
Author
Josh G. Nickel;Stanford W. Crane;Myoung-soo Jeon;Ton Wang;Zsolt Horvath;Sangwook Lee;Andreas C. Cangellaris Cangellari
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
55
Lastpage
58
Keywords
"Signal design","Connectors","Integrated circuit interconnections","Pins","Crosstalk","Electronic packaging thermal management","Manufacturing","Printed circuits","Transmission line matrix methods","Optical design"
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN
0-7803-9821-1
Type
conf
DOI
10.1109/SPI.2002.258275
Filename
4027654
Link To Document