DocumentCode :
3623764
Title :
System-On-a-Package Technologies for Enabling Future Microsystems
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
61
Lastpage :
61
Keywords :
"System-on-a-chip","Silicon","USA Councils","RF signals","Radio frequency","Micromechanical devices","Electronics packaging","Cost function","Circuits"
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN :
0-7803-9821-1
Type :
conf
DOI :
10.1109/SPI.2002.258277
Filename :
4027656
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3623764
