DocumentCode :
3623766
Title :
On the Modeling of Packages from Their Time Responses
Author :
F. G. Canavero;S. Grivet-Talocia;H. Kruger;I. A. Maio;I. S. Stievano;P. Thoma
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
69
Lastpage :
72
Keywords :
"Packaging","Circuit simulation","Bandwidth","Transmission line matrix methods","Power system transients","Electromagnetic transients","Circuit testing","Electromagnetic scattering","Sampling methods","Electromagnetic fields"
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN :
0-7803-9821-1
Type :
conf
DOI :
10.1109/SPI.2002.258285
Filename :
4027659
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3623766
