3623778

Organic Chip Packaging Technology For High Speed Processor Applications

Bernd Garben;Andreas Huber;Dierk Kaller;Erich Klink

2002

6/24/1905 12:00:00 AM

119

122

"Packaging","Wiring","Signal generators","Signal processing","Impedance","Electric variables","Dielectric materials","Dielectric losses","Paper technology","Wire"

ieee

Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings

0-7803-9821-1

conf

10.1109/SPI.2002.258316

4027674