• DocumentCode
    3623792
  • Title

    Study of copper diffusion into tantalum nitride (Ta/sub 2/N) by rapid thermal annealing (RTA)

  • Author

    S. W. Loh;D. H. Zhang;R. Liu;C. Y. Li;A. T. S. Wee

  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    177
  • Lastpage
    180
  • Keywords
    "Copper","Plasma temperature","Electrical resistance measurement","Plasma measurements","Amorphous materials","Grain boundaries","Rapid thermal annealing","Sputtering","Atomic layer deposition","Atomic measurements"
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
  • Print_ISBN
    0-7803-9821-1
  • Type

    conf

  • DOI
    10.1109/SPI.2002.258309
  • Filename
    4027690
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3623792