DocumentCode :
3623792
Title :
Study of copper diffusion into tantalum nitride (Ta/sub 2/N) by rapid thermal annealing (RTA)
Author :
S. W. Loh;D. H. Zhang;R. Liu;C. Y. Li;A. T. S. Wee
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
177
Lastpage :
180
Keywords :
"Copper","Plasma temperature","Electrical resistance measurement","Plasma measurements","Amorphous materials","Grain boundaries","Rapid thermal annealing","Sputtering","Atomic layer deposition","Atomic measurements"
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN :
0-7803-9821-1
Type :
conf
DOI :
10.1109/SPI.2002.258309
Filename :
4027690
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3623792
