DocumentCode :
3624070
Title :
Current Challenges in Cu Electromigration Reliability
Author :
Christine Hau-Riege
Author_Institution :
AMD
fYear :
2006
Firstpage :
217
Lastpage :
217
Keywords :
"Electromigration","Niobium compounds","Titanium compounds","Electronic design automation and methodology","Negative bias temperature instability","CMOS technology","Integrated circuit reliability","Integrated circuit interconnections"
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2006 IEEE International
ISSN :
1930-8841
Print_ISBN :
1-4244-0296-4
Electronic_ISBN :
2374-8036
Type :
conf
DOI :
10.1109/IRWS.2006.305256
Filename :
4098733
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3624070
