DocumentCode :
36242
Title :
Susceptibility of Smart Power ICs to Radio Frequency Interference
Author :
Fiori, Franco
Author_Institution :
Dept. of Electron. & Telecommun., Politec. di Torino, Turin, Italy
Volume :
29
Issue :
6
fYear :
2014
fDate :
Jun-14
Firstpage :
2787
Lastpage :
2797
Abstract :
This paper deals with the susceptibility to radio frequency interference (RFI) of the analog front ends embedded in smart power integrated circuits. The case of RFI injected in the power transistor terminals that propagates to the analog front ends of the same integrated circuit is investigated using equivalent circuits that include the silicon substrate. The demodulation of the interference that takes place in the analog front-end circuits is evaluated by means of an approximate nonlinear method. In particular, it is shown that the demodulation of the substrate interference in a MOS differential input stage depends on the asymmetry of the circuits connected to the input terminals. Based on this, a simple method to increase the immunity to such interference is presented and its effectiveness is proved through computer simulations and through measurements carried out on a test chip.
Keywords :
elemental semiconductors; equivalent circuits; power integrated circuits; power transistors; radiofrequency interference; silicon; MOS differential input stage; RFI; analog front-end circuits; approximate nonlinear method; computer simulations; equivalent circuits; interference demodulation; power transistor terminals; radiofrequency interference; silicon substrate; smart power IC; smart power integrated circuits; test chip; Couplings; Integrated circuit modeling; Interference; Power transistors; Substrates; Switching circuits; Analog circuits; electromagnetic compatibility (EMC); electromagnetic susceptibility; radio frequency interference (RFI); smart power integrated circuits; substrate coupling;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2013.2273123
Filename :
6558755
Link To Document :
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