DocumentCode

3624530

Title

Assesment of Metal Foam Cooling of High-Power Electronics

Author

N. Dukhan;N. M. Martinez Toro;J. O. Class Quinones;Y. Feng Peng

Author_Institution

University of Puerto Rico-Mayagez, Puerto Rico

fYear

2005

Firstpage

601

Lastpage

601

Keywords

"Metal foam","Electronics cooling"

Publisher

ieee

Conference_Titel

Telecommunications Conference, 2005. INTELEC ´05. Twenty-Seventh International

ISSN

0275-0473

Print_ISBN

978-3-8007-2905-0

Electronic_ISBN

2158-5210

Type

conf

DOI

10.1109/INTLEC.2005.335166

Filename

4134405