Title :
Assesment of Metal Foam Cooling of High-Power Electronics
Author :
N. Dukhan;N. M. Martinez Toro;J. O. Class Quinones;Y. Feng Peng
Author_Institution :
University of Puerto Rico-Mayagez, Puerto Rico
Keywords :
"Metal foam","Electronics cooling"
Conference_Titel :
Telecommunications Conference, 2005. INTELEC ´05. Twenty-Seventh International
Print_ISBN :
978-3-8007-2905-0
Electronic_ISBN :
2158-5210
DOI :
10.1109/INTLEC.2005.335166
