• DocumentCode
    3624597
  • Title

    Adaptive Modeling of Complex Packaging Geometries Using Haar-based MRTD Algorithms

  • Author

    B. McGarvey;D. Staiculescu;M. Tentzeris;J. Laskar

  • Author_Institution
    Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
  • fYear
    2000
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The Haar-based MRTD algorithm is applied to the design and optimization of complex 3D RF Packaging geometries. Significant numerical aspects concerning the implementation of Boundary Conditions and the thresholding of the wavelet coefficients are discussed in detail and guidelines for the efficient modeling of a practical Flip-Chip package are derived. Multiresolution Time-Domain Techniques - Expansion Basis
  • Keywords
    "Solid modeling","Packaging","Geometry","Algorithm design and analysis","Design optimization","Radio frequency","Boundary conditions","Wavelet coefficients","Guidelines","Time domain analysis"
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000. 30th European
  • Type

    conf

  • DOI
    10.1109/EUMA.2000.338748
  • Filename
    4139761
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3624597