Title :
Adaptive Modeling of Complex Packaging Geometries Using Haar-based MRTD Algorithms
Author :
B. McGarvey;D. Staiculescu;M. Tentzeris;J. Laskar
Author_Institution :
Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
Abstract :
The Haar-based MRTD algorithm is applied to the design and optimization of complex 3D RF Packaging geometries. Significant numerical aspects concerning the implementation of Boundary Conditions and the thresholding of the wavelet coefficients are discussed in detail and guidelines for the efficient modeling of a practical Flip-Chip package are derived. Multiresolution Time-Domain Techniques - Expansion Basis
Keywords :
"Solid modeling","Packaging","Geometry","Algorithm design and analysis","Design optimization","Radio frequency","Boundary conditions","Wavelet coefficients","Guidelines","Time domain analysis"
Conference_Titel :
Microwave Conference, 2000. 30th European
DOI :
10.1109/EUMA.2000.338748
