Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages

The main aim for development of small electronic packages is supported by an ongoing development of portable communications devices. Thin silicon dies are believed to improve as device performance as its reliability. Additionally, novel packaging techniques as stacked packaging reduce packaging cost, size, improve functionality and reliability. In case of the stacked packages, wafers are stacked to form 3D multi-chip package. On the other hand, the electronic market requires novel and efficient numerical designing tools to deal properly with the optimization. The goal of the current work was to design a reliable numerical model of the stacked package and afterwards perform numerical multi-objective optimization in reference to a number of variables, which influence the stacked package reliability.