• DocumentCode
    3624995
  • Title

    Influence of the reduced oxygen concentration on the wetting force

  • Author

    Karel Dusek;Jan Urbanek

  • Author_Institution
    Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology, Technick? 2, Prague 6, 166 27, Czech Republic. Email: dusekk1@fel.cvut.cz
  • fYear
    2006
  • fDate
    5/1/2006 12:00:00 AM
  • Firstpage
    193
  • Lastpage
    196
  • Abstract
    The knowledge of actual value of surface tension is important for the understanding to several soldering aspects, such as wetting, joint shape, fluxing action and, particularly, for the quantification of solderability testing. High surface tension is required for wave soldering.Values of surface tension are mainly caused by measurement conditions (temperature, ambient -air, inert atmosphere of the different composition etc.). We have measured influence of the reduced oxygen concentration on the wetting force. The change of the wetting force is related to the change of the surface tension. We used a wetting balance technique to measure the wetting force change which depends on the changing oxygen concentration. The measurement was carried out on two different types of solders (Sn63Pb37 and Sn95,5Ag3,8Cu0,7) and on non-wetting measurement specimen (teflo-non-stick cylinder).
  • Keywords
    "Force measurement","Surface tension","Testing","Solids","Atmospheric measurements","Temperature measurement","Shape measurement","Equations","Density measurement","Volume measurement"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2006. ISSE ´06. 29th International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    1-4244-0550-5
  • Electronic_ISBN
    2161-2064
  • Type

    conf

  • DOI
    10.1109/ISSE.2006.365384
  • Filename
    4216024