DocumentCode :
3626708
Title :
Designing HV active clamps for HBM robustness
Author :
Guido Notermans;Olivier Quittard;Anco Heringa;Zeljko Mrcarica;Fabrice Blanc;Hans van Zwol;Theo Smedes;Thomas Keller;Peter de Jong
Author_Institution :
NXP Semiconductors, Binzstr. 38, CH-8045 Zurich, Switzerland
fYear :
2007
Abstract :
Electrical measurements, physical damage analysis, and device simulation have proved that the drain junction breakdown voltage is the determining failure criterion for our HV active clamps. Using this criterion, the HBM and TLP robustness of such clamps can be accurately predicted by circuit simulation without the need for test silicon.
Keywords :
"Clamps","Robustness","Failure analysis","Circuit testing","Electrostatic discharge","Circuit simulation","Protection","Analytical models","Pulse circuits","Switches"
Publisher :
ieee
Conference_Titel :
29th Electrical Overstress/Electrostatic Discharge Symposium, 2007. EOS/ESD
Print_ISBN :
978-1-58537-136-5
Type :
conf
DOI :
10.1109/EOSESD.2007.4401730
Filename :
4401730
Link To Document :
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